Glass Chips Cleaning Protocol

Glass Chips Cleaning Protocol

Cleaning Protocol for Glass Chips –v1.0

Joshua

 

Prior to PECVD

  1. Sonicate with soap water (use liquid detergent with no particles), acetone, and IPA for a few minutes each. Blow dry with nitrogen.
  2. Immerse in 1:3 solution of hydrogen peroxide in concentrated sulfuric acid at 100C for 1 hour. Rinse acid off, then immerse in DI water to protect sample.
  3. In cleanroom, remove sample from water and bake at 115C

 

After PECVD, prior to initial PL

  1. Rinse (or sonicate if it has been a while since the PECVD coating) with acetone and IPA to remove dust. Blow dry with nitrogen.
  2. Also consider plasma cleaning if PECVD coating is not fresh.
  3. Seal container with Parafilm for transport to/from cleanroom.

 

During PL/EBL process

Prior to spin-coating

  1. Rinse with acetone and IPA to remove dust. Blow dry with nitrogen. Bake to ensure complete evaporation of IPA from substrate.
  2. For secondary lithography (i.e. after outer electrodes have been made), plasma clean for 1 min to encourage good contact between metal layers.

After exposure/development

  1. Seal container with Parafilm for transport to evaporator (if in different room).
  2. Plasma clean for one minute prior to evaporation.